SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
卷宗概要
发明人
HYEONJEONG HWANG; JUNGHOON KANG
IPC 分类
CPC 分类
A semiconductor package includes a redistribution layer, a first semiconductor chip arranged on one surface of the redistribution layer, a photonic integrated circuit (PIC) arranged on one side of the first semiconductor chip on the redistribution layer, and a layer structure arranged on the first semiconductor chip and the PIC. The layer structure may radiate heat generated in the first semiconductor chip to an outside and transmit light incident from the outside to the PIC. Alternatively, the layer structure may transmit light generated in the PIC to the outside.
原文（中文）
A semiconductor package includes a redistribution layer, a first semiconductor chip arranged on one surface of the redistribution layer, a photonic integrated circuit (PIC) arranged on one side of the first semiconductor chip on the redistribution layer, and a layer structure arranged on the first semiconductor chip and the PIC. The layer structure may radiate heat generated in the first semiconductor chip to an outside and transmit light incident from the outside to the PIC. Alternatively, the layer structure may transmit light generated in the PIC to the outside.