PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
卷宗概要
发明人
Atsuyasu Nozaki; Kazuya Oota
IPC 分类
CPC 分类
There are provided a photosensitive resin composition including a resin which is a polyimide having a polymerizable group and a weight-average molecular weight of 5,000 or more and less than 30,000, a polymerizable compound, and a photopolymerization initiator; a cured substance obtained by curing the resin composition; a laminate including the cured substance; a manufacturing method for the cured substance; a manufacturing method for a laminate; a manufacturing method for a semiconductor device, including the manufacturing method for the cured substance; and a semiconductor device including the cured substance.
原文（中文）
There are provided a photosensitive resin composition including a resin which is a polyimide having a polymerizable group and a weight-average molecular weight of 5,000 or more and less than 30,000, a polymerizable compound, and a photopolymerization initiator; a cured substance obtained by curing the resin composition; a laminate including the cured substance; a manufacturing method for the cured substance; a manufacturing method for a laminate; a manufacturing method for a semiconductor device, including the manufacturing method for the cured substance; and a semiconductor device including the cured substance.