PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

原文（中文）

A photosensitive resin composition including a resin having a repeating unit represented by Formula (1-1) and a photosensitizing agent, a cured substance obtained by curing the resin composition, a laminate including the cured substance, a manufacturing method for the cured substance, a manufacturing method for a laminate, a manufacturing method for a semiconductor device including the manufacturing method for the cured substance, and a semiconductor device including the cured substance. In Formula (1-1), Xrepresents an organic group including a structure obtained by removing two or more hydrogen atoms from a specific structure, Yrepresents an organic group including a structure obtained by removing two or more hydrogen atoms from a specific structure, R's each independently represent an organic group having a polymerizable group, m represents an integer of 0 to 4, and n represents an integer of 1 or more.