METHOD AND SYSTEM OF CORRECTING OPTICAL PROXIMITY CORRECTION (OPC) MODEL FOR MANUFACTURING SEMICONDUCTOR DEVICE
卷宗概要
申请人
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
发明人
CHIEN-JEN LAI; SPENSER ANDERSON
IPC 分类
CPC 分类
A method of training model for manufacturing a semiconductor device is provided. Training image data is collected from at least two wafer images on a same wafer. A metrology error function is determined according to the contour difference between at least two wafer images. A metrology-aware correction model including an optical proximity correction (OPC) model and a metrology model is trained based on the metrology error function associated with the metrology model, to obtain a trained OPC model and a trained metrology model.
原文（中文）
A method of training model for manufacturing a semiconductor device is provided. Training image data is collected from at least two wafer images on a same wafer. A metrology error function is determined according to the contour difference between at least two wafer images. A metrology-aware correction model including an optical proximity correction (OPC) model and a metrology model is trained based on the metrology error function associated with the metrology model, to obtain a trained OPC model and a trained metrology model.