GROUP-BASED SIMULATIONS OF HYBRID BUMPS OF CIRCUIT DESIGNS FOR 3-DIMENSIONAL INTEGRATED CIRCUITS
卷宗概要
发明人
Shohdy Abd Elkader; Mai Abdelrahman; Ahmed Nasser
IPC 分类
CPC 分类
Systems and methods are presented for group-based simulations of hybrid bumps of circuit designs for 3-dimensional integrated circuits (3DICs). A method may include identifying hybrid bumps for an input circuit design, and each hybrid pump may represent a connection element between circuits of a 3-dimensional integrated circuit (3DIC) structure. The method may also include grouping the hybrid bumps into bump groups based on a pitch value that specifies a distance between the hybrid bumps from one another, wherein each bump group comprises multiple hybrid bumps. For a given bump group of the bump groups, the method may include performing a point-to-point simulation from a representative point determined for the given bump group and using a result of the point-to-point simulation from the representative point as a simulation result for each of the multiple hybrid bumps included in the given bump group.
原文（中文）
Systems and methods are presented for group-based simulations of hybrid bumps of circuit designs for 3-dimensional integrated circuits (3DICs). A method may include identifying hybrid bumps for an input circuit design, and each hybrid pump may represent a connection element between circuits of a 3-dimensional integrated circuit (3DIC) structure. The method may also include grouping the hybrid bumps into bump groups based on a pitch value that specifies a distance between the hybrid bumps from one another, wherein each bump group comprises multiple hybrid bumps. For a given bump group of the bump groups, the method may include performing a point-to-point simulation from a representative point determined for the given bump group and using a result of the point-to-point simulation from the representative point as a simulation result for each of the multiple hybrid bumps included in the given bump group.