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METHOD AND APPARATUS FOR ETCHING A SURFACE

发明专利审中
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19权利要求 · 2 独立
§ Ⅰ

卷宗概要

发明人

Matthew Surman; Mikhail Krishtab; Elisa K. Atosuo; Tao Xu; Elina Färm; Charles Dezelah; Patricio Eduardo Romero

IPC 分类

H1L 21/3213H1L 21/67

CPC 分类

H1L21/32135H1L21/67069

Methods and related systems for etching. Embodiments of the present disclosure comprise etching an etchable layer by executing a cyclical etching process comprising a plurality of etching cycles. Ones from the plurality of etching cycles comprise a volatilization reactant pulse that comprises exposing a substrate to a volatilization reactant.

原文(中文)

Methods and related systems for etching. Embodiments of the present disclosure comprise etching an etchable layer by executing a cyclical etching process comprising a plurality of etching cycles. Ones from the plurality of etching cycles comprise a volatilization reactant pulse that comprises exposing a substrate to a volatilization reactant.