SUBSTRATE SUPPORT ASSEMBLY AND PLASMA PROCESSING DEVICE
卷宗概要
发明人
Atsushi KAWABATA
IPC 分类
CPC 分类
A substrate support assembly includes a base, a substrate support on the base, and a supply unit. The base includes a first channel and a second channel. The first channel is a channel for a first heat transfer medium. The second channel is a channel for a second heat transfer medium. The supply unit is connected to the second channel. The second channel extends between the first channel and the substrate support. The supply unit is connected to the second channel to supply the second heat transfer medium to the second channel. The second heat transfer medium is a liquid metal.
原文（中文）
A substrate support assembly includes a base, a substrate support on the base, and a supply unit. The base includes a first channel and a second channel. The first channel is a channel for a first heat transfer medium. The second channel is a channel for a second heat transfer medium. The supply unit is connected to the second channel. The second channel extends between the first channel and the substrate support. The supply unit is connected to the second channel to supply the second heat transfer medium to the second channel. The second heat transfer medium is a liquid metal.