SEMICONDUCTOR MANUFACTURING METHOD USING WARPAGE DEFORMATION
卷宗概要
发明人
Jinyoung LEE; Sunghyup KIM
IPC 分类
CPC 分类
A semiconductor manufacturing method using warpage deformation includes thermally deforming a three-dimensional warpage of a wafer into a two-dimensional warpage of the wafer by adjusting a temperature of each area of a plurality of areas of a stage where the wafer is mounted, chucking the wafer when the three-dimensional warpage of the wafer has been deformed into the two-dimensional warpage of the wafer, and performing a semiconductor process while the wafer is chucked.
原文（中文）
A semiconductor manufacturing method using warpage deformation includes thermally deforming a three-dimensional warpage of a wafer into a two-dimensional warpage of the wafer by adjusting a temperature of each area of a plurality of areas of a stage where the wafer is mounted, chucking the wafer when the three-dimensional warpage of the wafer has been deformed into the two-dimensional warpage of the wafer, and performing a semiconductor process while the wafer is chucked.