SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD USING THE SAME
卷宗概要
发明人
HWAYOUNG LEE
IPC 分类
CPC 分类
Provided are substrate processing systems and substrate processing methods. A substrate processing method includes grinding a back side of a substrate, attaching a die attach film to the substrate that is ground, and inspecting the substrate. Inspecting the substrate includes using a vision camera to inspect a surface of the substrate, and using an infrared laser device to inspect an interior of the substrate.
原文（中文）
Provided are substrate processing systems and substrate processing methods. A substrate processing method includes grinding a back side of a substrate, attaching a die attach film to the substrate that is ground, and inspecting the substrate. Inspecting the substrate includes using a vision camera to inspect a surface of the substrate, and using an infrared laser device to inspect an interior of the substrate.