PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE COMPRISING SAME
卷宗概要
发明人
Jincheol KIM; SeHan Yun; Jungju JO; Tae Kyoung KIM; Jun Rok OH
IPC 分类
CPC 分类
A packaging substrate according to the present disclosure includes a glass core and an insulating layer disposed on the glass core. The glass core has a thickness of 100 μm or more. The insulating layer has an HEI value, which is the heat-resistant elasticity index of Equation 1 below, of 1.2 or more. HEI=TgE CTE× [ ]Equationin Equation 1, Tg is the glass transition temperature (unit: ° C.), E is the elastic modulus (unit: GPa) measured at 23° C., and CTE is the coefficient of thermal expansion (ppm/° C.). In this case, damage to the glass core during a process of forming a redistribution layer can be effectively suppressed.
原文（中文）
A packaging substrate according to the present disclosure includes a glass core and an insulating layer disposed on the glass core. The glass core has a thickness of 100 μm or more. The insulating layer has an HEI value, which is the heat-resistant elasticity index of Equation 1 below, of 1.2 or more. HEI=TgE CTE× [ ]Equationin Equation 1, Tg is the glass transition temperature (unit: ° C.), E is the elastic modulus (unit: GPa) measured at 23° C., and CTE is the coefficient of thermal expansion (ppm/° C.). In this case, damage to the glass core during a process of forming a redistribution layer can be effectively suppressed.