THERMALLY EFFICIENT INTEGRATED DEVICE
卷宗概要
发明人
David Coenen; Herman Oprins; Joris Van Campenhout; Peter Verheyen; Yoojin Ban; Minkyu Kim; Filippo Jacopo Ferraro; Robert Miller; Philippe Absil; Dimitrios Velenis
IPC 分类
CPC 分类
Electronic-photonic systems including an integrated device, and methods for manufacturing the integrated device, are provided. In one aspect, the integrated device includes an electronic integrated circuit (EIC) and a photonic integrated circuit (PIC) bonded and electrically connected to the EIC. The PIC includes a waveguide and a heater configured to heat the waveguide. The integrated device includes one or more cavities arranged between the heater and the EIC for thermally isolating the heater from the EIC.
原文（中文）
Electronic-photonic systems including an integrated device, and methods for manufacturing the integrated device, are provided. In one aspect, the integrated device includes an electronic integrated circuit (EIC) and a photonic integrated circuit (PIC) bonded and electrically connected to the EIC. The PIC includes a waveguide and a heater configured to heat the waveguide. The integrated device includes one or more cavities arranged between the heater and the EIC for thermally isolating the heater from the EIC.