Heat Dissipation for Semiconductor Circuit
卷宗概要
申请人
Avago Technologies International Sales Pte. Limited
发明人
Sheng Zhang; Near Margalit; David John Kenneth Meadowcroft; Sukeshwar Kannan
IPC 分类
CPC 分类
The subject technology is directed to semiconductors and fabrication methods thereof. The subject technology provides a first circuit, a die attach film coupled to a bottom side of the first circuit, and a heat spreader layer coupled between the first circuit and the die attach film. In some cases, the heat spreader layer is directly coupled to at least one of the first circuit or the die attach film. In some cases, the first layer or the die attach film is non-conductive. The heat spreader layer can be configured to dissipate heat laterally along a side of the first circuit. There are other embodiments as well.
原文（中文）
The subject technology is directed to semiconductors and fabrication methods thereof. The subject technology provides a first circuit, a die attach film coupled to a bottom side of the first circuit, and a heat spreader layer coupled between the first circuit and the die attach film. In some cases, the heat spreader layer is directly coupled to at least one of the first circuit or the die attach film. In some cases, the first layer or the die attach film is non-conductive. The heat spreader layer can be configured to dissipate heat laterally along a side of the first circuit. There are other embodiments as well.