HEAT SPREADERS THAT INCLUDE THERMAL DISSIPATION REGIONS COMPRISING DIAMOND
卷宗概要
发明人
Je-Young CHANG; Aastha UPPAL; Aravindha ANTONISWAMY
IPC 分类
CPC 分类
Assemblies comprising semiconductor devices, packages, and heat spreaders are provided. The heat spreaders comprise heat dissipation regions comprising diamond. The diamond can be, for example, a solid diamond plate or a composite comprising diamond particles. Methods for manufacturing assemblies comprising heat spreaders that include heat dissipation regions comprising diamond are also provided.
原文（中文）
Assemblies comprising semiconductor devices, packages, and heat spreaders are provided. The heat spreaders comprise heat dissipation regions comprising diamond. The diamond can be, for example, a solid diamond plate or a composite comprising diamond particles. Methods for manufacturing assemblies comprising heat spreaders that include heat dissipation regions comprising diamond are also provided.