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SEMICONDUCTOR PACKAGE
发明专利审中
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20权利要求 · 3 独立
§ Ⅰ
卷宗概要
发明人
Yeonghyeon GIM; Junho Lee
IPC 分类
H1L 23/498H1L 23/H1L 23/538H1L 25/65H1L 25/18H10B 80/H10D 80/30
CPC 分类
H1L23/49816H1L24/13H1L24/16H1L23/5385H1L25/652H1L25/657H1L25/18H1L2224/13016H1L2224/13082H1L2224/13147H1L2224/13155H1L2224/13611H1L2224/13613H1L2224/13639H1L2224/13647H1L2224/16227H1L2225/6517H1L2225/652H1L2924/3511H10B80/H10D80/30
A semiconductor package may include a package substrate including a substrate pad, a solder ball in contact with a bottom surface of the substrate pad, and a core enclosed by the solder ball. An area of a bottom surface of the core may be larger than an area of a top surface of the core.
原文（中文）
A semiconductor package may include a package substrate including a substrate pad, a solder ball in contact with a bottom surface of the substrate pad, and a core enclosed by the solder ball. An area of a bottom surface of the core may be larger than an area of a top surface of the core.