METHODS AND SYSTEMS FOR FORMING INTEGRATED CIRCUIT PACKAGES COMPRISING GLASS LAYERS
卷宗概要
申请人
Intel Corporation
发明人
Andrew Matthew Jimenez; Manohar Konchady; Mahdi Mohammadighaleni; Hiroki Tanaka; Ehsan Zamani; Whitney M. Bryks; Haobo Chen; Gang Duan; Benjamin T. Duong; Darko Grujicic; Jung Kyu Han; Thomas S. Heaton; Shayan Kaviani; Brandon Christian Marin; Robert A. May; Seyyed Yahya Mousavi; Bai Nie; Srinivas Venkata Ramanuja Pietambaram; Bohan Shan; Joshua J. Stacey; Elham Tavakoli; Yekan Wang; Zhixin Xie
IPC 分类
CPC 分类
An apparatus comprising a package substrate, the package substrate comprising a glass layer, a first layer comprising a photo-imageable dielectric (PID) material above the glass layer, a second layer below the glass layer, the second layer comprising the PID material, at least one buildup layer above the first layer, and at least one buildup layer below the second layer.
原文（中文）
An apparatus comprising a package substrate, the package substrate comprising a glass layer, a first layer comprising a photo-imageable dielectric (PID) material above the glass layer, a second layer below the glass layer, the second layer comprising the PID material, at least one buildup layer above the first layer, and at least one buildup layer below the second layer.