SEMICONDUCTOR PACKAGING SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
卷宗概要
发明人
Wen-Hung HU
IPC 分类
CPC 分类
A semiconductor packaging substrate structure is provided and includes a circuit build-up structure and at least one winding spiral coil. The circuit build-up structure has at least one first patterned wiring layer, a first dielectric layer, a second dielectric layer, and a third dielectric layer. The winding spiral coil is composed of an enameled wire. The first patterned wiring layer is embedded in the third dielectric layer. The winding spiral coil is embedded in the second dielectric layer. The first patterned wiring layer and the winding spiral coil are electrically connected to each other. A manufacturing method of the semiconductor packaging substrate structure is further provided.
原文（中文）
A semiconductor packaging substrate structure is provided and includes a circuit build-up structure and at least one winding spiral coil. The circuit build-up structure has at least one first patterned wiring layer, a first dielectric layer, a second dielectric layer, and a third dielectric layer. The winding spiral coil is composed of an enameled wire. The first patterned wiring layer is embedded in the third dielectric layer. The winding spiral coil is embedded in the second dielectric layer. The first patterned wiring layer and the winding spiral coil are electrically connected to each other. A manufacturing method of the semiconductor packaging substrate structure is further provided.