PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
卷宗概要
发明人
Jinhyung JUNG
IPC 分类
CPC 分类
Provided is a package substrate that includes a substrate body part, a bonding pad, and a connection wiring that is connected to the bonding pad in a first direction parallel to a surface of the substrate body part. At least a portion of the bonding pad is embedded in the substrate body part. At least a portion of the connection wiring is embedded in the substrate body part. The bonding pad includes an embedding layer embedded in the substrate body part, a first metal layer formed on the embedding layer, and a second metal layer formed on the first metal layer. The first metal layer has an upper surface that is flat.
原文（中文）
Provided is a package substrate that includes a substrate body part, a bonding pad, and a connection wiring that is connected to the bonding pad in a first direction parallel to a surface of the substrate body part. At least a portion of the bonding pad is embedded in the substrate body part. At least a portion of the connection wiring is embedded in the substrate body part. The bonding pad includes an embedding layer embedded in the substrate body part, a first metal layer formed on the embedding layer, and a second metal layer formed on the first metal layer. The first metal layer has an upper surface that is flat.