METHODS OF FABRICATING GLASS PANELS TO FORM GLASS CORE PACKAGE STRUCTURES
卷宗概要
发明人
Rahul Bhure
IPC 分类
CPC 分类
Microelectronic integrated circuit package structures include a package substrate comprising a build-up layer on a glass core, the glass core comprising a first side and a second side opposite the first side. A conductor is within a through glass via (TGV) extending through the glass core. A coating is on a sidewall of at least a portion of the glass core, the coating comprising a polymer material.
原文（中文）
Microelectronic integrated circuit package structures include a package substrate comprising a build-up layer on a glass core, the glass core comprising a first side and a second side opposite the first side. A conductor is within a through glass via (TGV) extending through the glass core. A coating is on a sidewall of at least a portion of the glass core, the coating comprising a polymer material.