SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
卷宗概要
申请人
Amkor Technology Singapore Holding Pte. Ltd.
发明人
Keun Soo Kim; Jae Yun Kim; Byoung Jun Ahn; Dong Soo Ryu; Dae Byoung Kang; Chel Woo Park
IPC 分类
CPC 分类
A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.
原文（中文）
A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.