PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

原文（中文）

Disclosed is a package structure, including: a substrate; a first dielectric layer on the substrate; a second dielectric layer on the first dielectric layer; a multilayer wiring layer in the first dielectric layer and the second dielectric layer; an I/O pad in the first dielectric layer, and a portion of a top surface of the I/O pad is covered by the second dielectric layer; a probe pad in the first dielectric layer and the second dielectric layer, wherein a top surface of the probe pad is higher than the top surface of the I/O pad, and is coplanar with a top surface of the second dielectric layer, and the top surface of the I/O pad is coplanar with a top surface of the first dielectric layer; and an I/O opening is disposed in the second dielectric layer to expose the I/O pad.