STRUCTURES WITH ENHANCED THERMAL HEAT SPREADING AND REMOVAL
卷宗概要
申请人
International Business Machines Corporation
发明人
John Knickerbocker; John W Golz; Keiji Matsumoto; Mukta Ghate Farooq
IPC 分类
CPC 分类
Structures including semiconductor chips (including chiplets and stacked chips/chiplets) are provided in which thermal heat removal is enhanced. The enhanced thermal heat removal is provided by utilizing interlayer dielectric (ILD) materials in at least one of the frontside back-end-of-the-line (BEOL) structure or the backside BEOL structure that have a high thermal conductivity.
原文（中文）
Structures including semiconductor chips (including chiplets and stacked chips/chiplets) are provided in which thermal heat removal is enhanced. The enhanced thermal heat removal is provided by utilizing interlayer dielectric (ILD) materials in at least one of the frontside back-end-of-the-line (BEOL) structure or the backside BEOL structure that have a high thermal conductivity.