INNER SPACER AS ETCH STOP LAYER FOR BACKSIDE POWER RAIL
卷宗概要
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
Ruilong Xie; Tao Li; HUIMEI ZHOU; Reinaldo Vega; Xiaoming Yang
IPC 分类
CPC 分类
Embodiments disclosed herein include a semiconductor structure. The semiconductor structure may include a deep via connecting a first source/drain (S/D) to a backside power rail (RB) below the first S/D, a dielectric etch stop inner spacer below the first S/D, and an RB sidewall surrounding the RB comprising an edge laterally overlapping the dielectric etch stop inner spacer.
原文（中文）
Embodiments disclosed herein include a semiconductor structure. The semiconductor structure may include a deep via connecting a first source/drain (S/D) to a backside power rail (RB) below the first S/D, a dielectric etch stop inner spacer below the first S/D, and an RB sidewall surrounding the RB comprising an edge laterally overlapping the dielectric etch stop inner spacer.