MEMORY MODULE

原文（中文）

A memory module includes a module substrate, and a memory device on a front surface of the module substrate, wherein the module substrate includes a plurality of insulating layers, a plurality of rear surface connection pads, and an outer edge dummy layer on the plurality of insulating layers, wherein the plurality of rear surface connection pads include a first metal layer, a second metal layer, and a third metal layer, wherein the first metal layer includes copper, the second metal layer includes nickel, and the third metal layer includes gold, wherein the outer edge dummy layer extends along an outer edge of the rear surface of the module substrate, and wherein the plurality of rear surface connection pads are in contact with a plurality of connector pins in an external compression mounting connector, respectively.