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METAL-INSULATOR-METAL (MIM) CAPACITOR ARCHITECTURES WITH LOW ELECTRICAL RESISTANCE

发明专利审中
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20权利要求 · 3 独立
§ Ⅰ

卷宗概要

IPC 分类

H1L 23/64H1L 21/48H1L 23/H1L 23/367H1L 23/498

CPC 分类

H1L23/642H1L21/4857H1L23/3675H1L23/49822H1L23/49838H1L24/16H1L2224/16225H1L2924/19041H1L2924/19103

Capacitor structures that include a cell metal-insulator-metal (MIM) stack within topographic cell containers and cell interconnects that couple the MIM stack of a plurality of cells in electrical parallel to shared capacitor terminals. A first cell interconnect of a first conductive material may span an area under a plurality of the cell containers and a second conductive material of the MIM stack that is confined as a liner of the cell containers is in contact with the first cell interconnect, thereby reducing an electrical resistance of a first shared capacitor electrode. An insulator and another conductive material of the MIM stack is formed within the plurality of cell containers. A second cell interconnect of another conductive material may span an area over a plurality of the cell containers to further couple the MIM stacks of a plurality of cells in electrical parallel to another shared capacitor terminal.

原文(中文)

Capacitor structures that include a cell metal-insulator-metal (MIM) stack within topographic cell containers and cell interconnects that couple the MIM stack of a plurality of cells in electrical parallel to shared capacitor terminals. A first cell interconnect of a first conductive material may span an area under a plurality of the cell containers and a second conductive material of the MIM stack that is confined as a liner of the cell containers is in contact with the first cell interconnect, thereby reducing an electrical resistance of a first shared capacitor electrode. An insulator and another conductive material of the MIM stack is formed within the plurality of cell containers. A second cell interconnect of another conductive material may span an area over a plurality of the cell containers to further couple the MIM stacks of a plurality of cells in electrical parallel to another shared capacitor terminal.