CONTAMINATION FREE COPPER INTERCONNECT ON ALUMINUM PAD
卷宗概要
发明人
Shafaat AHMED; Darren DENARDIS
IPC 分类
CPC 分类
Embodiments disclosed herein include an apparatus that comprises a pad, and the pad comprises aluminum. In an embodiment, a liner is on a sidewall of the pad, and the liner extends past a surface of the pad. In an embodiment, a first layer is over the pad, and the first layer comprises copper. In an embodiment, a second layer is over the first layer, and the second layer is a dielectric material. In an embodiment, a via that passes through the second layer and contacts the first layer.
原文（中文）
Embodiments disclosed herein include an apparatus that comprises a pad, and the pad comprises aluminum. In an embodiment, a liner is on a sidewall of the pad, and the liner extends past a surface of the pad. In an embodiment, a first layer is over the pad, and the first layer comprises copper. In an embodiment, a second layer is over the first layer, and the second layer is a dielectric material. In an embodiment, a via that passes through the second layer and contacts the first layer.