SEMICONDUCTOR DEVICE INCLUDING BONDING OF STACKED STRUCTURE PARTS AND METHOD OF FABRICATING THE SAME
卷宗概要
发明人
Won Tae KOO; Mir IM
IPC 分类
CPC 分类
A semiconductor device according to an embodiment includes a first stacked structure and a second stacked structure that are bonded to each other. The first stacked structure includes a first base body and a first connection structure disposed on a surface over the first base body. The second stacked structure includes a second base body and a second connection structure disposed on a surface over the second base body. Each of the first and second connection structures includes a connection pad, a carbon-based barrier layer disposed on the connection pad, and a bonding layer disposed on the carbon-based barrier layer and coupling the first and second connection structures to each other.
原文（中文）
A semiconductor device according to an embodiment includes a first stacked structure and a second stacked structure that are bonded to each other. The first stacked structure includes a first base body and a first connection structure disposed on a surface over the first base body. The second stacked structure includes a second base body and a second connection structure disposed on a surface over the second base body. Each of the first and second connection structures includes a connection pad, a carbon-based barrier layer disposed on the connection pad, and a bonding layer disposed on the carbon-based barrier layer and coupling the first and second connection structures to each other.