PACKAGE COMPRISING A PASSIVE DEVICE WITH VARIABLE SIZED BUMP INTERCONNECTS
卷宗概要
发明人
Yanmei SONG; Sun Woong YUN; Chung-Yi CHOU; William STONE
IPC 分类
CPC 分类
A package comprising a package interposer and a first integrated device coupled to the package interposer. The package interposer comprises a first metallization portion; a second metallization portion; a passive device located between the first metallization portion and the second metallization portion. The passive device comprises a plurality of bump interconnects. The plurality of bump interconnects comprise a first plurality of bump interconnects, where each bump interconnect from the first plurality of bump interconnects comprises a first minimum width; and a second plurality of bump interconnects, where each bump interconnect from the second plurality of bump interconnects comprises a second minimum width that is greater than the first minimum width.
原文（中文）
A package comprising a package interposer and a first integrated device coupled to the package interposer. The package interposer comprises a first metallization portion; a second metallization portion; a passive device located between the first metallization portion and the second metallization portion. The passive device comprises a plurality of bump interconnects. The plurality of bump interconnects comprise a first plurality of bump interconnects, where each bump interconnect from the first plurality of bump interconnects comprises a first minimum width; and a second plurality of bump interconnects, where each bump interconnect from the second plurality of bump interconnects comprises a second minimum width that is greater than the first minimum width.