ELECTRONIC DEVICE AND FLIP-CHIP DIE ASSEMBLY WITH PREFORMED UNDERFILL AND STUD BUMPS
卷宗概要
发明人
How Kiat Liew; Amirun Hamizan Bin Budizaman; Ahmad Ridzuan Bin Abd Rahman
IPC 分类
CPC 分类
An electronic device includes a flip-chip die assembly having a semiconductor die and a preformed underfill, the semiconductor die having conductive bond pads spaced apart from one another along a side of the semiconductor die and conductive stud bumps having proximal ends on respective ones of the conductive bond pads and distal ends extending outward from the side, and the preformed underfill extending on a portion of the side between the conductive stud bumps and exposing the distal ends of the conductive stud bumps.
原文（中文）
An electronic device includes a flip-chip die assembly having a semiconductor die and a preformed underfill, the semiconductor die having conductive bond pads spaced apart from one another along a side of the semiconductor die and conductive stud bumps having proximal ends on respective ones of the conductive bond pads and distal ends extending outward from the side, and the preformed underfill extending on a portion of the side between the conductive stud bumps and exposing the distal ends of the conductive stud bumps.