SEMICONDUCTOR PACKAGE
卷宗概要
发明人
Dongwon KANG; Changyeon SONG; Jae-Ean LEE
IPC 分类
CPC 分类
A semiconductor package that includes a first redistribution substrate including a first surface and a second surface facing the first surface; a semiconductor chip on the first surface; an electronic element on the second surface; and an underfill pattern between the electronic element and the second surface. The first redistribution substrate includes a first insulating layer, and an insulating pattern and a dam structure both on the first insulating layer. The dam structure is spaced apart from the electronic element in a first direction parallel to the second surface. The insulating pattern includes an insulating material different from that of the first insulating layer. The insulating pattern is in contact with the first insulating layer and the underfill pattern.
原文（中文）
A semiconductor package that includes a first redistribution substrate including a first surface and a second surface facing the first surface; a semiconductor chip on the first surface; an electronic element on the second surface; and an underfill pattern between the electronic element and the second surface. The first redistribution substrate includes a first insulating layer, and an insulating pattern and a dam structure both on the first insulating layer. The dam structure is spaced apart from the electronic element in a first direction parallel to the second surface. The insulating pattern includes an insulating material different from that of the first insulating layer. The insulating pattern is in contact with the first insulating layer and the underfill pattern.