LAND-SIDE DIE COOLING OF DOUBLE-SIDED PACKAGE SUBSTRATES
卷宗概要
发明人
Tarek GEBRAEL; Mohamed ELHEBEARY; Darshan RAVOORI; Matthew T. MAGNAVITA; Xiao LU
IPC 分类
CPC 分类
Semiconductor device assemblies that comprise a package substrate having semiconductor devices on two sides. A solder layer can thermally couple one or more semiconductor devices on a side of the package with a circuit board. Methods of manufacturing assemblies having a semiconductor device thermally coupled to a circuit board are also provided.
原文（中文）
Semiconductor device assemblies that comprise a package substrate having semiconductor devices on two sides. A solder layer can thermally couple one or more semiconductor devices on a side of the package with a circuit board. Methods of manufacturing assemblies having a semiconductor device thermally coupled to a circuit board are also provided.