METHOD OF BONDING A FIRST SUBSTRATE TO A SECOND SUBSTRATE, BONDING APPARATUS AND ASSEMBLY OF FIRST AND SECOND SUBSTRATES
卷宗概要
发明人
Markus WIMPLINGER; Christian MÜHLSTÄTTER
IPC 分类
CPC 分类
A method of bonding a first substrate () to a second substrate (), the first substrate wherein preferably a subsection of the second substrate () in the second partial section is vertically offset with respect to a subsection of the second substrate () in the first partial portion in a direction perpendicular to a main extension plane, and wherein for the relative alignment of the primary section and the secondary section with respect to one another, in particular with respect to a direction running essentially parallel to the bonding direction, a first curvature of the first substrate () and/or a second curvature of the second substrate () is modified by means of a deformation system in a region adjacent to the bond wave () and/or in a region including the bond wave ().
原文（中文）
A method of bonding a first substrate () to a second substrate (), the first substrate wherein preferably a subsection of the second substrate () in the second partial section is vertically offset with respect to a subsection of the second substrate () in the first partial portion in a direction perpendicular to a main extension plane, and wherein for the relative alignment of the primary section and the secondary section with respect to one another, in particular with respect to a direction running essentially parallel to the bonding direction, a first curvature of the first substrate () and/or a second curvature of the second substrate () is modified by means of a deformation system in a region adjacent to the bond wave () and/or in a region including the bond wave ().