PACKAGING APPARATUS FOR INTEGRATED CIRCUIT COMPONENT

原文（中文）

An integrated circuit component package apparatus includes a plurality of feeding rails, and a plurality of workstations. The feeding rails define a transporting route thereon, and are for transporting a component carriage boat carrying an integrated circuit component along the transporting route. The plurality of workstations are sequentially arranged along the transporting route, and include a thermal interface material application station, an adhesive coating station, a lid placement station, and a lid bonding station. The thermal interface material application station is for applying a thermal interface material on the integrated circuit component. The adhesive coating station is for applying an adhesive on the integrated circuit component. The lid placement station is for placing a lid on the integrated circuit component. The lid bonding station is for bonding the lid onto the integrated circuit component.