SYSTEMS AND METHODS FOR LED WITH STACKED BONDING STRUCTURES

原文（中文）

A micro-display chip comprises a micro light-emitting diode (micro-LED) array having a plurality of micro-LEDs. A micro-LED includes a substrate having a circuit and a metal layer disposed on the substrate and in electrical contact with the circuit. The micro-LED further includes a light emitting layer disposed on the metal layer and an isolation layer covering a sidewall of the light emitting layer. An opening is formed in the isolation layer and exposes at least a portion of a surface of the light emitting layer. The micro-LED further includes a conductive layer disposed on the isolation layer, wherein at least a portion of the conductive layer is disposed in the opening and in contact with the at least a portion of the surface of the light emitting layer.