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DESIGN AND STRUCTURES OF HIGH-SPEED INTERCONNECTS FOR IMPROVED SIGNAL INTEGRITY
发明专利审中
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20权利要求 · 2 独立
§ Ⅰ
卷宗概要
发明人
Guoan Wang; Yingcong Zhang
IPC 分类
H1P 3/8H1P 5/18H1P 11/H3H 7/1
CPC 分类
H1P3/81H1P5/185H1P11/3H3H7/1791
An improved design methodology and new interconnect structures, which includes integrating interdigital trapezoidal tabs and defected microstrip line to effectively reduce far-end crosstalk including a new design method and unique structures aimed at enhancing signal integrity.
原文（中文）
An improved design methodology and new interconnect structures, which includes integrating interdigital trapezoidal tabs and defected microstrip line to effectively reduce far-end crosstalk including a new design method and unique structures aimed at enhancing signal integrity.