RADIO FREQUENCY DEVICES AND METHODS FOR MANUFACTURING THEREOF
卷宗概要
发明人
Walter HARTNER; Tuncay ERDÖL; Christian GEISSLER; Ernst SELER
IPC 分类
CPC 分类
A radio frequency (RF) device includes a substrate; an RF chip arranged on a first main surface of the substrate; a first coupling element arranged in the substrate and configured to couple an RF signal into or out of the substrate; a second coupling element arranged in the substrate and configured to couple an RF signal into or out of the substrate; a first RF signal path coupling the RF chip and the first coupling element, wherein the first RF signal path is at least partially arranged in the substrate and includes a first section with an RF signal propagation parallel to the first main surface; and a second RF signal path coupling the RF chip and the second coupling element, the second RF signal path including a first section with an RF signal propagation parallel to the first main surface.
原文（中文）
A radio frequency (RF) device includes a substrate; an RF chip arranged on a first main surface of the substrate; a first coupling element arranged in the substrate and configured to couple an RF signal into or out of the substrate; a second coupling element arranged in the substrate and configured to couple an RF signal into or out of the substrate; a first RF signal path coupling the RF chip and the first coupling element, wherein the first RF signal path is at least partially arranged in the substrate and includes a first section with an RF signal propagation parallel to the first main surface; and a second RF signal path coupling the RF chip and the second coupling element, the second RF signal path including a first section with an RF signal propagation parallel to the first main surface.