CIRCUIT ASSEMBLY
卷宗概要
申请人
AUTONETWORKS TECHNOLOGIES, LTD.; SUMITOMO WIRING SYSTEMS, LTD.; SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人
Koushi IGURA; Hiroki SHIMODA; Taiji YANAGIDA
IPC 分类
CPC 分类
A circuit assembly that can reduce stress generated at an interface between a heat conducting member and a case is disclosed. A circuit assemblyincludes: heat generating componentsa bus barconnected to connector portionsof the heat generating componentsa casethat houses the heat generating componentsand the bus barand a heat conducting memberthat is placed on a mounted surfaceof the caseis in thermal contact with the caseand the bus barand is sandwiched therebetween. The caseincludes a displacement restricting portionthat engages with a heat conductive memberand restricts displacement of the heat conducting member
原文（中文）
A circuit assembly that can reduce stress generated at an interface between a heat conducting member and a case is disclosed. A circuit assemblyincludes: heat generating componentsa bus barconnected to connector portionsof the heat generating componentsa casethat houses the heat generating componentsand the bus barand a heat conducting memberthat is placed on a mounted surfaceof the caseis in thermal contact with the caseand the bus barand is sandwiched therebetween. The caseincludes a displacement restricting portionthat engages with a heat conductive memberand restricts displacement of the heat conducting member