ELECTRONIC DEVICE ANTENNA USING HEAT SINK COMPONENTS
卷宗概要
发明人
Sneha Rajeev SONDUR; Marc HARPER; Chulmin HAN
IPC 分类
CPC 分类
An electronic device includes one or more processing components that generate heat during operation. A heat sink is thermally coupled with the one or more processing components, such that the heat sink assembly dissipates at least a portion of the heat generated by the one or more processing components, wherein one or more components of the heat sink assembly are spaced away from a conductive chassis wall of the electronic device to form a cavity. An antenna feed line is disposed within the cavity, such that the antenna feed line and the cavity collectively form a cavity-backed slot-type antenna usable to transmit radio frequency (RF) signals.
原文（中文）
An electronic device includes one or more processing components that generate heat during operation. A heat sink is thermally coupled with the one or more processing components, such that the heat sink assembly dissipates at least a portion of the heat generated by the one or more processing components, wherein one or more components of the heat sink assembly are spaced away from a conductive chassis wall of the electronic device to form a cavity. An antenna feed line is disposed within the cavity, such that the antenna feed line and the cavity collectively form a cavity-backed slot-type antenna usable to transmit radio frequency (RF) signals.