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SEMICONDUCTOR DEVICE INCLUDING FERROELECTRIC LAYER AND PARAELECTRIC LAYER

发明专利审中
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20权利要求 · 2 独立
§ Ⅰ

卷宗概要

发明人

Haeyeon JUN; Chang-Soo LEE; Jisung KIM; Jaewoo PARK; Junnoh LEE

IPC 分类

H10B 51/30H1L 23/H1L 25/16H10B 41/27H10B 41/30H10B 43/27H10B 43/30H10B 51/20H10B 80/

CPC 分类

H10B51/30H1L25/16H10B41/27H10B41/30H10B43/27H10B43/30H10B51/20H10B80/H1L24/32H1L24/48H1L24/73H1L2224/32145H1L2224/32225H1L2224/48091H1L2224/48147H1L2224/48227H1L2224/73265H1L2225/6506H1L2225/651H1L2225/6562H1L2924/1438

Provided is a semiconductor device including a substrate, a stacked structure including a plurality of gate electrodes and a plurality of interlayer insulating layers, and a plurality of channel structures penetrating the stacked structure. Each of the plurality of channel structures includes a channel poly layer, a crystalline layer including hafnium (Hf) or zirconium (Zr), an electron trap layer, and a plurality of gate insulating layers positioned between the electron trap layer and the plurality of gate electrodes at a height corresponding to the plurality of gate electrodes. The crystalline layer includes a plurality of ferroelectric layers positioned at a height corresponding to the plurality of gate electrodes, and a plurality of paraelectric layers positioned at a height corresponding to the plurality of interlayer insulating layers. The plurality of ferroelectric layers and the plurality of paraelectric layers have different crystal structures while containing the same material.

原文(中文)

Provided is a semiconductor device including a substrate, a stacked structure including a plurality of gate electrodes and a plurality of interlayer insulating layers, and a plurality of channel structures penetrating the stacked structure. Each of the plurality of channel structures includes a channel poly layer, a crystalline layer including hafnium (Hf) or zirconium (Zr), an electron trap layer, and a plurality of gate insulating layers positioned between the electron trap layer and the plurality of gate electrodes at a height corresponding to the plurality of gate electrodes. The crystalline layer includes a plurality of ferroelectric layers positioned at a height corresponding to the plurality of gate electrodes, and a plurality of paraelectric layers positioned at a height corresponding to the plurality of interlayer insulating layers. The plurality of ferroelectric layers and the plurality of paraelectric layers have different crystal structures while containing the same material.