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METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE INCLUDING OVONIC THRESHOLD SWITCH FILM

发明专利审中
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20权利要求 · 3 独立
§ Ⅰ

卷宗概要

发明人

Jong Hyun PAEK; Woo Jun JEONG; Seul Ji SONG

IPC 分类

H10B 63/H10N 70/

CPC 分类

H10B63/24H10B63/84H10N70/841

A method of manufacturing a semiconductor memory device includes forming a first conductive line extending in a first direction on a substrate, forming a second conductive line extending in a second direction on the first conductive line, and forming a first memory cell between the first conductive line and the second conductive line by sequentially stacking a first electrode, a first high-concentration electrode, a first ovonic threshold switch (OTS) film, and a second electrode, wherein a concentration of nitrogen (N) contained in the first high-concentration electrode is greater than a concentration of nitrogen (N) contained in the first electrode.

原文(中文)

A method of manufacturing a semiconductor memory device includes forming a first conductive line extending in a first direction on a substrate, forming a second conductive line extending in a second direction on the first conductive line, and forming a first memory cell between the first conductive line and the second conductive line by sequentially stacking a first electrode, a first high-concentration electrode, a first ovonic threshold switch (OTS) film, and a second electrode, wherein a concentration of nitrogen (N) contained in the first high-concentration electrode is greater than a concentration of nitrogen (N) contained in the first electrode.