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TECHNOLOGIES FOR EPITAXIAL PEROVSKITE FERROELECTRIC TRANSISTORS ON BUFFERED SILICON

发明专利审中
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20权利要求 · 3 独立
§ Ⅰ

卷宗概要

发明人

Arnab Sen Gupta; Pratyush P. Buragohain; Punyashloka Debashis; Raseong Kim; Matthew V. Metz; Suehyun Park; John J. Plombon; Rachel A. Steinhardt; Ian Alexander Young

IPC 分类

H1L 29/51H1L 29/4H1L 29/6H1L 29/423H1L 29/49H1L 29/66H1L 29/775H1L 29/78

CPC 分类

H10D64/689H10D30/14H10D30/43H10D30/62H10D30/6735H10D30/6739H10D62/121H10D62/40H10D99/

Technologies for epitaxial perovskite ferroelectric transistors on buffered silicon are disclosed. In an illustrative embodiment, a barrier layer of titanium nitride is deposited on a silicon substrate using domain matching epitaxy, which allows the titanium nitride to grow with relatively low stress and a low number of defects, despite a 22% misfit between the lattice constant for titanium nitride and that lattice constant for silicon. The barrier layer prevents silicon monoxide (SiO) from forming when oxides are grown as later layers. In some embodiments, some or all of the titanium nitride barrier layer may be used as a gate electrode for the transistor.

原文(中文)

Technologies for epitaxial perovskite ferroelectric transistors on buffered silicon are disclosed. In an illustrative embodiment, a barrier layer of titanium nitride is deposited on a silicon substrate using domain matching epitaxy, which allows the titanium nitride to grow with relatively low stress and a low number of defects, despite a 22% misfit between the lattice constant for titanium nitride and that lattice constant for silicon. The barrier layer prevents silicon monoxide (SiO) from forming when oxides are grown as later layers. In some embodiments, some or all of the titanium nitride barrier layer may be used as a gate electrode for the transistor.