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Micro LED transfer method and array substrate

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62645228专利族
§ Ⅰ

卷宗概要

申请人

BOE TECHNOLOGY GROUP CO LTD

申请号

CN2018102730

发明人

ZOU XIANGXIANG; HE XIAOLONG

申请日

Jan 2, 2018

公开日

Jun 29, 2018

专利族 ID

62645228

IPC 分类

G03F7/00G03F7/004

CPC 分类

G03F7/0002G03F7/004

The invention provides a micro LED transfer method and an array substrate. A photoresist pattern containing a big-end-down opening is formed on an organic layer of the array substrate, the upper edgeof the opening is smaller or equal to a to-be-transferred light-emitting component, therefore, after a transfer substrate carrying the to-be-transferred light-emitting component is aligned with the array substrate, the to-be-transferred light-emitting component can be firmly clamped in the opening by applying pressure to the transfer substrate, adhesion force of the to-be-transferred light-emitting component to the array substrate is increased, the risk that the to-be-transferred light-emitting component is carried away by the transfer substrate is reduced in a transfer plate removal process is reduced, transfer success rate is increased, product yield is increased, and dark spot defects are avoided.

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