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Piezoresistive chip and preparation method thereof, and piezoresistive sensor

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92334479专利族
§ Ⅰ

卷宗概要

申请人

BEIJING BOE SENSING TECH CO LTD; BOE TECHNOLOGY GROUP CO LTD; BEIJING BOE TECHNOLOGY DEV CO LTD

申请号

CN202410518379

发明人

WANG LIHUI; LI YUE; WEI QIUXU; GUO WEILONG; ZHANG TAONAN; CHANG WENBO; SUN JIE; HE NANA; LIU HANQING; DING DING

申请日

Apr 26, 2024

公开日

Aug 2, 2024

专利族 ID

92334479

IPC 分类

B81B3/00B81C1/00G01L1/22

CPC 分类

B81B3/0021B81C1/00134G01L1/22G01L1/2262G01L1/2281B81B2201/0264

The invention discloses a piezoresistive chip, a preparation method thereof and a piezoresistive sensor. The piezoresistive chip comprises a substrate provided with a pressure cavity and a Wheatstone bridge located on the substrate; the Wheatstone bridge comprises a plurality of piezoresistors, and the orthographic projections of the piezoresistors on the plane where the substrate is located are all located in the orthographic projection of the pressure cavity on the plane where the substrate is located; the plurality of piezoresistors at least comprise a first piezoresistor, a second piezoresistor, a third piezoresistor and a fourth piezoresistor which are connected with one another; the piezoresistive chip further comprises a shielding layer, the orthographic projection of the shielding layer on the plane where the substrate is located is at least partially overlapped with the orthographic projection of at least one piezoresistor on the plane where the substrate is located, the shielding layer is configured to be connected with a grounding end, and the long-term stability of the piezoresistive chip can be improved.

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