Air pressure film crimping device

The invention relates to the technical field of semiconductor packaging, in particular to an air pressure film crimping device which comprises a chip pressing assembly, a cushion block pressing assembly, a clamping piece pressing assembly, an end plate, a lower plate, an upper plate and a top plate. Gas with different pressures is introduced into a first cavity, a second cavity and a third cavity, so that a first pressing rod, a second pressing rod and a third pressing rod generate different output pressures, the pressing rods with three different output pressures can be arranged in the same device, a chip, a cushion block and a clamping piece can be sintered on the same device, the equipment cost is reduced, and the production efficiency is improved. More importantly, transfer among three sets of different sintering devices is not needed, so that the operation cost is reduced, and the productivity is improved; the first piston is arranged in an up-down layered manner, and the design that the second cavity surrounds the first cavity is combined, so that the first pressing rod and the second pressing rod with different output pressures can be compatible with each other in a narrow space, a chip and a cushion block adjacent to the chip are sintered at the same time, and the packaging efficiency is improved.