Preparation method of planar light-splitting passive optical chip

The embodiment of the invention provides a preparation method of a planar light-splitting passive optical chip, and the method comprises the steps: making a rotating light beam, carrying out the spiral cutting modification of a silicon substrate through the rotating light beam, and carrying out the corrosion through a hydrofluoric acid solution, so as to form an optical fiber array row; depositing a metal layer on the silicon substrate; manufacturing an optical device, and connecting the optical device to the metal layer; an optical fiber is connected to one end of the optical fiber array row, and the optical device is connected to the other end of the optical fiber array row. According to the preparation method provided by the embodiment of the invention, by introducing a rotating light beam silicon substrate cutting technology, the steps of silicon substrate cutting and modification are simplified, the cutting quality and the cutting efficiency are also improved, and meanwhile, the processes of metal layer deposition, optical device connection and the like are optimized, so that the preparation difficulty and the preparation cost are reduced, the production efficiency is also improved, and the production cost is reduced. And the preparation of the optical chip is more efficient and economical.