Packaging structure, packaging method and electronic equipment

The invention relates to the technical field of chip packaging, and particularly provides a packaging structure, a packaging method and electronic equipment. The packaging structure comprises a packaging substrate, a heat conduction layer and a chip set, and the chip set comprises a plurality of chips fixedly arranged on the packaging substrate. The heat conduction layer is arranged on the side, away from the packaging substrate, of the chip set, the heat conduction layer is fixedly connected with each chip, and the surface, away from the chip set, of the heat conduction layer is a plane. The electronic equipment comprises a heat radiator and the packaging structure, wherein the heat radiator is fixed on one side, deviating from the chip set, of the heat conduction layer of the packaging structure. The packaging method comprises the following steps: providing a chip set, wherein the chip set comprises a plurality of chips; and packaging the plurality of chips between the packaging substrate and the heat conduction layer, wherein the surface, deviating from the chip group, of the heat conduction layer is a plane. According to the packaging structure, the packaging method and the electronic equipment, the problem that the chips are easy to damage due to impact force when the top-cover-free multi-chip sealed packaging structure falls off in the transportation process is solved.