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Cooling device, cooling system and electronic equipment

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数据来源:EPO OPS

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92806135专利族
§ Ⅰ

卷宗概要

申请人

HUAWEI TECH CO LTD

申请号

CN202310353948

发明人

SHE ZHENYU; WANG CHAO; TAN XIANGHUI; YAN TAO

申请日

Mar 25, 2023

公开日

Sep 27, 2024

专利族 ID

92806135

IPC 分类

H05K7/20

CPC 分类

H05K7/20H05K7/20309H05K7/20327

The embodiment of the invention provides a cooling device, a cooling system and electronic equipment, relates to the technical field of heat dissipation, and aims to solve the problem of poor heat dissipation effect of a heating element in a compact space. The cooling device comprises a first shell, a second shell and a middle shell, and a plurality of jet flow holes are formed in the middle shell. The first shell and the second shell are located on the two opposite sides of the middle shell respectively, a jet flow cavity is defined by the first shell and the middle shell, and a boiling cavity is defined by the second shell and the middle shell; the jet hole is communicated with the jet cavity and the boiling cavity; the surface, deviating from the middle shell, of the second shell comprises a heating element veneer; the cooling device further comprises a liquid inlet channel and a liquid outlet channel, the liquid inlet channel is communicated with the jet flow cavity, and the liquid outlet channel is communicated with the boiling cavity. The cooling device is used for cooling the heating element.

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