Optical communication device

The embodiment of the utility model provides optical communication equipment capable of being applied to an FTTR scene. The optical communication device comprises a circuit board, an optical transceiver assembly, a chip and a flexible heat conduction structure. The circuit board comprises a first area and a second area, and the chip and the optical transceiver assembly are installed in the first area. The chip comprises a micro-processing chip and a driving chip, the micro-processing chip is connected with the driving chip through a signal line, and the driving chip is electrically connected with the optical transceiver assembly. The flexible heat conduction structure is connected between the circuit board of the first area and the circuit board of the second area, and the flexible heat conduction structure is used for conducting heat of the first area to the second area, so that the influence of heat generated by the chip on the optical transceiver assembly can be reduced, the possibility that the optical transceiver assembly is damaged due to high temperature is reduced, and the service life of the optical transceiver assembly is prolonged. And the reliability of optical communication equipment is improved.