Shell and component common ground structure and electronic equipment
数据来源:EPO OPS
正文暂时无法获取,您仍可查看已取得的基本信息。
卷宗概要
申请号
CN202421595319U
发明人
DENG MINGYANG; KANG ZILING; LIN ZHEN; LIANG ZHIJUN; JI CUIPING
申请日
Jul 8, 2024
公开日
Sep 24, 2024
专利族 ID
92784396
IPC 分类
The embodiment of the utility model discloses a common ground structure of a shell and a component and electronic equipment. The common ground structure of the shell and the components comprises the shell with conductive performance, a multi-layer circuit board, the components arranged on the multi-layer circuit board and a fastener with conductive performance, the multilayer circuit board is provided with a circuit board through hole, the fastener is locked into the circuit board through hole, and the fastener locked into the circuit board through hole is in contact with the shell; the inner wall of the circuit board through hole is provided with a plurality of conductive contacts used for making contact with the fastener, different conductive contacts are connected with different target inner electric layers of the multilayer circuit board, and the target inner electric layers are inner electric layers, connected with the component, in the multilayer circuit board. According to the common-ground structure of the shell and the component provided by the embodiment of the invention, the risk of an insulation fault of the component can be reduced.
EPO 研究资料
选择栏目后,按需获取当前文献的官方资料。
选择上方栏目查看对应资料。