№ US20260003141A1発明
審査中PACKAGE HAVING COMPONENT CARRIER AND EMBEDDED OPTICAL AND ELECTRIC CHIPS WITH HORIZONTAL SIGNAL PATH IN BETWEEN
PACKAGE HAVING COMPONENT CARRIER AND EMBEDDED OPTICAL AND ELECTRIC CHIPS WITH HORIZONTAL SIGNAL PATH IN BETWEEN
Provided is a package having a component carrier with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and an optical chip and an electric chip being functionally coupled with each other and being embedded side-by-side in the component carrier so that a signal path between the optical chip and the electric chip is within a horizontal plane.
❖AT & S Austria Technologie & Systemtechnik AktiengesellschaftTanja JOERG; Erich SCHLAFFER§ 2/20 請求項G2B 6/42, H1L 23/, H1L 23/498 +19