原始名称记载: ZEUS CO., LTD.

The present invention relates to a substrate separation apparatus, and the substrate separation apparatus includes a separation member () that enters a bonded portion () of a bonded substrate () in which a first substrate () and a second substrate () are bonded, and forms a crack, a sensor module () configured to photograph the bonded substrate () and the separation member () to obtain measurement values corresponding to distances from the sensor module () to the bonded substrate () and the separation member (), and a processor () configured to move the separation member () to a height of the bonded portion () on the basis of the measurement values.